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January 2009

DesignerCouncil@IPC.ORG
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DesignerCouncil <[log in to unmask]>
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Designers Council Forum <[log in to unmask]>
Date:
Mon, 12 Jan 2009 15:41:18 -0500
Reply-To:
"(Designers Council Forum)" <[log in to unmask]>, [log in to unmask]
Subject:
Re: solder thickness after reflow for tol. stackup
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