If you tent the back side you will have a risk of little volcanoes
underneath the part during soldering.

The document you are thinking of is IPC-4671
(Design Guide for Protection of Printed Board Via Structures)


On Thu, Apr 24, 2014 at 2:58 PM, Fred Dark <[log in to unmask]> wrote:

> Hello all - we have been adding a solder-mask dot on the same side as the
> IC's with a "GND-SLUG"... no issue... however if a "SLUG" has a large
> quantity of vias due to the requirement to dissipate heat here is where I
> have a issue... not enough area for paste and proper solder percentage to
> the area... so in this case I was suggesting to tent the opposite side that
> the IC resides on... filling, capping and planarized is the way to go,
> however would tenting the opposite side be a issue..? note via hole size is
> 10mils... anyone aware of the IPC standard and or requirement..?
>
> Regard's, Frederick Dark Jr.
> Manager Senior PCB Designer
> Crestron Electronics, Inc.
> 22 Link Drive Rockleigh N.J. 07647
> P:201.750.7004 ext.11320
> F:210.767.5772
> [log in to unmask]
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