If you tent the back side you will have a risk of little volcanoes underneath the part during soldering. The document you are thinking of is IPC-4671 (Design Guide for Protection of Printed Board Via Structures) On Thu, Apr 24, 2014 at 2:58 PM, Fred Dark <[log in to unmask]> wrote: > Hello all - we have been adding a solder-mask dot on the same side as the > IC's with a "GND-SLUG"... no issue... however if a "SLUG" has a large > quantity of vias due to the requirement to dissipate heat here is where I > have a issue... not enough area for paste and proper solder percentage to > the area... so in this case I was suggesting to tent the opposite side that > the IC resides on... filling, capping and planarized is the way to go, > however would tenting the opposite side be a issue..? note via hole size is > 10mils... anyone aware of the IPC standard and or requirement..? > > Regard's, Frederick Dark Jr. > Manager Senior PCB Designer > Crestron Electronics, Inc. > 22 Link Drive Rockleigh N.J. 07647 > P:201.750.7004 ext.11320 > F:210.767.5772 > [log in to unmask] > > > > This e-mail message and all attachments transmitted with it may contain > legally privileged and confidential information intended solely for the use > of the addressee. If you are not the intended recipient, you are hereby > notified that any reading, dissemination, distribution, copying, or other > use of this message or its attachments is strictly prohibited. > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > > > --------------------------------------------------------------------------------- > DesignerCouncil Mail List provided as a free service by IPC using LISTSERV > 16.0. > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF DesignerCouncil. > To temporarily stop/(restart) delivery of DesignerCouncil send: SET > DesignerCouncil NOMAIL/(MAIL) > For additional information, or contact Keach Sasamori at [log in to unmask] 847-615-7100 > ext.2815 > > --------------------------------------------------------------------------------- > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 16.0. To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL) For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ---------------------------------------------------------------------------------