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Subject:	Re: VIA in Pad
From:	"Mitch S. Morey" <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Tue, 29 Jun 2004 14:06:55 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

Happy,

You are a wealth of information. If anyone hasn't visited Happy's website
and ftp treasure trove, you will NEVER know what you're missing. There is
a massive amount of information there that will help educate even the most
experienced designer. Go! Do! Incredible.

Thank again Happy. I've got a ton of reading to get started on. It's a
pleasure.

Good day.

Mitch Morey

>
> Tom,
> One assumes you are talking about 'microvia-in-pad' VIP and not drilled
(snip)
> Solectron did some assembly studies about the voiding with
> 'microvia-in-pad' and had a few conclusions.  Their report had a number of
> good cross-sections about the issue.  The key is to get all the parties
> talking early to decide what the trade-offs are.  There need not be a
> problem if the issue is flushed out early enough.
> SOLECTRON VIA IN PAD STUDY
> Happy Holden
> Westwood Associates
>
>         Subject:        [DC] VIA in Pad

> We're a CM.  One of our customers is asking us to build a board assembly
> that will be using BGAs with VIAs in pads.  They are in the design stages
> at this point, and we have some concerns with having a Via in the middle
> of a BGA pad.  Anyone have suggestions and/or experience with this??
>



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