Happy, You are a wealth of information. If anyone hasn't visited Happy's website and ftp treasure trove, you will NEVER know what you're missing. There is a massive amount of information there that will help educate even the most experienced designer. Go! Do! Incredible. Thank again Happy. I've got a ton of reading to get started on. It's a pleasure. Good day. Mitch Morey > > Tom, > One assumes you are talking about 'microvia-in-pad' VIP and not drilled (snip) > Solectron did some assembly studies about the voiding with > 'microvia-in-pad' and had a few conclusions. Their report had a number of > good cross-sections about the issue. The key is to get all the parties > talking early to decide what the trade-offs are. There need not be a > problem if the issue is flushed out early enough. > SOLECTRON VIA IN PAD STUDY > Happy Holden > Westwood Associates > > Subject: [DC] VIA in Pad > We're a CM. One of our customers is asking us to build a board assembly > that will be using BGAs with VIAs in pads. They are in the design stages > at this point, and we have some concerns with having a Via in the middle > of a BGA pad. Anyone have suggestions and/or experience with this?? > ----------------------------------------- This email was sent using http://cafemail.pcbcafe.com . --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------