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Reply To: | (Designers Council Forum) |
Date: | Wed, 21 Apr 2004 14:28:17 -0500 |
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ATTENTION!!
Designers and Manufacturers
BGA Design and Assembly Process Implementation Workshop
May 27-28, 2004 ? Philadelphia, PA
Instructors: Dieter Bergman, IPC - Association Connecting Electronics Industries & Ray Prasad, Ray Prasad Consultancy Group
This workshop addresses industry concerns from those people contemplating using BGAs to those who process high quality assemblies.
What You Will Learn:
* Challenges to implementing BGA and Fine Pitch BGA technology
* Land pattern routing descriptions
* Surface finish strategy and requirements
* New x-ray technology for defect assessment
* Void accept/reject criteria
* Examples of BGA joint conditions
* Critical inspection, repair, and reliability issues associated with BGAs
* Acceptance and how to determine the reliability of assembly and attachment processes
Price: $495 IPC/Designers Councils Member $695 Non-member
REGISTER NOW! For more information or to download the registration form, please go to http://www.ipc.org/calendar/BGADesign_52704/BGADesign_52704.htm.
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