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March 2005

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Sender:	DesignerCouncil <[log in to unmask]>
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Date:	Wed, 2 Mar 2005 10:37:47 -0500
Reply-To:	"(Designers Council Forum)" <[log in to unmask]>, [log in to unmask]
Subject:	IPC 7351 & Glue Dots
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From:	Greg Holley <[log in to unmask]>
Parts/Attachments:	text/plain (22 lines)

DC members,

Is there any provision for glue dots in the new IPC 7351 land patterns?
Specifically the smaller chip components, 2012(0805)'s. I noticed that the
pad to pad spacing is pretty tight.

TIA
Greg Holley
Dade Behring Inc.


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