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Wed, 16 Apr 1997 14:57:11 -0400
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From [log in to unmask] Wed Apr 16 13:
50:50 1997
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Subject:
Solder Stencil Opening Area VS PCB Pad A
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Is there a rule-of-thumb when designing paste aperture sizes for   
non-standard pad sizes. I'm thinking about a copper area vs stencil   
opening area ratio for SMT.  

__________________________________
Scott Buscomb
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voice 770 338-6170
MTCC/Panasonic, Pager Development
Atlanta, GA USA 30174
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