DESIGNERCOUNCIL Archives

February 1998

DesignerCouncil@IPC.ORG

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Sender:
DesignerCouncil <[log in to unmask]>
X-To:
Leonard Toohey <[log in to unmask]>
Date:
Mon, 16 Feb 1998 21:36:39 -0800
Reply-To:
"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Louis Dallara <[log in to unmask]>
Subject:
From:
Louis Dallara <[log in to unmask]>
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Save The Planet
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Leonard;
The only large company to use via in land on a regular
basis is Lucent, they have the process down pat.
The trick is to figure how much solder you going
to lose to the hole.
It real helps on high density boards.
Lou

Leonard Toohey wrote:
>
> What is the state of the industry regarding putting
> vias in the center of SMT discrete device pads?
>
> I am mainly wanting to know about 0603, 0805 and 1206 devices.
> Is board thickness a factor?
> What about via hole size?
>
> Thanks,
>
> Leonard Toohey
> [log in to unmask]
> 12303 Technology Blvd.
> Austin, TX 78727
> Ph(512) 257-5423
> Fx(512) 249-7236
> http://www.netspeed.com
>
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--
Lou Dallara   Techno Visionary
"We have it in our power to begin the world again."
       -Thomas Paine, Common Sense (1776)
http://www.waterw.com/~ldallara       http://www.arcosanti.org

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To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
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Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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