DESIGNERCOUNCIL Archives

April 1998

DesignerCouncil@IPC.ORG
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DesignerCouncil <[log in to unmask]>
Subject:
Re: Breakouts for BGAs
From:
Lisa Williams <[log in to unmask]>
Date:
Wed, 8 Apr 1998 11:04:00 -0500
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Lisa Williams <[log in to unmask]>
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J-STD-013, Implementation of Ball Grid Array and other High Density Technology,
covers what you are looking for. It was published jointly by the IPC, MCNC, and
SEMATECH. It is available through the IPC at a price of $35 for members/ $70 for
nonmembers.

Contact the IPC order department at:
phone:  847.509.9700
fax:  847.509.9819
email:  [log in to unmask]
URL:  www.ipc.org

Lisa Williams
IPC

>>> "Hurst, Joe" <[log in to unmask]> 04/08/98 10:54PM >>>
Hello

        I am looking for advice on breakout patterns (fanouts) for BGA
devices and the construction of the vias used.  Does IPC have any
standards on this?

Thanks

Joe H.

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