 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uGTef-00008xC; Mon, 6 May 96 12:01 CDT |
| Content-Type: |
TEXT/PLAIN; charset=US-ASCII |
| Old-Return-Path: |
<willli> |
| Date: |
Mon, 6 May 1996 12:00:56 -0500 (CDT) |
| Precedence: |
list |
| Resent-From: |
|
| Message-ID: |
<Pine.3.89.9605061123.B62495-0100000@ipc> |
| MIME-Version: |
1.0 |
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Wed May 15 14: |
56:15 1996 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"SJKpk2.0.fT8.C1ZZn"@ipc> |
| Subject: |
|
| From: |
|
| X-Status: |
|
| X-Loop: |
|
| Resent-Sender: |
|
| Parts/Attachments: |
|
|
IPC-2141, Controlled Impedance Circuit Boards and High Speed Logic
Design, is now available for purchase through the IPC.
This guide is intended to be used by circuit designers, packaging
engineers, printed board fabricators, and procurement personnel so that
all may have a common understanding of each area.
The goal in packaging is to transfer a signal from one device to one or
more other devices, through a conductor. High-speed designs are defined
as designs in which the interconnecting properties affect circuit
performance and require unique consideration.
To order this document, contact the IPC Order Department at
(847) 509-9700 ext. 348, or email [log in to unmask]
Price: $25 members/$50 non-members
****************************************
Lisa M. Williams
Technical Staff
IPC
2215 Sanders Road
Northbrook, IL 60062
phone: (847) 509-9700 x 379
fax: (847) 509-9798
email: [log in to unmask]
****************************************
|
|
|
