Bill;

Oddly enough, there is an excellent article on this topic authored by
Happy Holden in this month's PCD&M. 
You can see it here:
http://www.nxtbook.com/nxtbooks/upmg/pcdf_200711/


Denis Lefebvre, CID+
Sr. PCB Designer
Finisar Corporation
(408)542-3832

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Brooks,Bill
Sent: Monday, December 03, 2007 3:21 PM
To: [log in to unmask]
Subject: [DC] Blind and buried vias... advice?

Is there someone out there that has a good reference for setting up
blind via and/or buried via technology for your board designs?
Questions that come to mind are things like:
 
Stackup options:
What is the best stackup arrangement for an 8 layer board with blind
vias? 
Best for electrical performance and best for manufacturing of the board?
What options do you have and what are the tradeoffs of using them? 
 
Aspect ratio of the vias: 
What is the best aspect ratio to use? 
When does it get too tough to build? 
What makes it easier to build? 
 
Mistakes to avoid: 
What are the cost drivers?  How can you avoid them? 
What examples of things you have seen attempted that just should not
have been done that way? 
How should they have been done? 
Via geometries, board stackups, etc... 
 
Process options, pro's and con's
 
Etc.., etc.. 
 
Please let me know if you have a source for this sort of data and what
your advice is for someone who is just getting into it.
 
Best regards,
 
Bill
 
 
 
 

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