> What are the drawbacks to tenting vias? I am planning on tenting vias
> using LPI both sides on SMOBC. The vias are .013 and .020. I realize the
> LPI is pulled into the holes causing a thinning of the mask.
> I am trying to prevent solder bridging during reflow and wave soldering.
>
> Any comments would be appreciated.
> TIA,
> Scott Buscomb
>

We here at I-O Corp. tent all our vias for the benefit of our in
circuit tester. I makes it to where there are no vacuum leaks there
by getting the board to "suck" down properly. I find a via size of
.018 is about the max for LPI soldermask.


*************************************************
Thanks
Walter L. Williams, Circuit Board Designer
I-O Corporation, SLC, Utah
Industry leader in IBM AS400 connectivity products
[log in to unmask]
Voice: 1-801-972-3558 ex 123
Alternate: 1-801-973-6767
*************************************************
Carpe Diem

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