> What are the drawbacks to tenting vias? I am planning on tenting vias > using LPI both sides on SMOBC. The vias are .013 and .020. I realize the > LPI is pulled into the holes causing a thinning of the mask. > I am trying to prevent solder bridging during reflow and wave soldering. > > Any comments would be appreciated. > TIA, > Scott Buscomb > We here at I-O Corp. tent all our vias for the benefit of our in circuit tester. I makes it to where there are no vacuum leaks there by getting the board to "suck" down properly. I find a via size of .018 is about the max for LPI soldermask. ************************************************* Thanks Walter L. Williams, Circuit Board Designer I-O Corporation, SLC, Utah Industry leader in IBM AS400 connectivity products [log in to unmask] Voice: 1-801-972-3558 ex 123 Alternate: 1-801-973-6767 ************************************************* Carpe Diem ################################################################ DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE DesignerCouncil <your full name> To unsubscribe: SIGNOFF DesignerCouncil ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################