IPC-2221, Section 8.3.1: Lead Mounted in Through-Holes:  Minimum of 0.5mm
and maximum of 1.5mm from suface of plating or foil.

Roger M. Stoops, C.I.D., PCB Designer


Trimble
Engineering and Construction Division
5475 Kellenburger Rd.
Dayton, OH 45424-1099 USA
Ph: +01 937.233.8921 or +01 937.233.4574 ext 288
Fax: +01 937.233.7511





I searched the several internet sites and couldn't find a standard that
covers the following question:

What is the MINIMUM pin length in order to be able to reliably solder a
through-hole component to the PWB?

The pin diameter is 25mils. Hole diameter is 40mils. Pad diameter is hole
diameter + 15mils. Board thickness is 78mils.

Can you point me to a reference regarding this matter?

Thanks in advance for any assistance.

Regards,
Manoj Viswambharan
Principal Design Engineer
Village Networks, Inc.
[log in to unmask]

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