IPC-2221, Section 8.3.1: Lead Mounted in Through-Holes: Minimum of 0.5mm and maximum of 1.5mm from suface of plating or foil. Roger M. Stoops, C.I.D., PCB Designer Trimble Engineering and Construction Division 5475 Kellenburger Rd. Dayton, OH 45424-1099 USA Ph: +01 937.233.8921 or +01 937.233.4574 ext 288 Fax: +01 937.233.7511 I searched the several internet sites and couldn't find a standard that covers the following question: What is the MINIMUM pin length in order to be able to reliably solder a through-hole component to the PWB? The pin diameter is 25mils. Hole diameter is 40mils. Pad diameter is hole diameter + 15mils. Board thickness is 78mils. Can you point me to a reference regarding this matter? Thanks in advance for any assistance. Regards, Manoj Viswambharan Principal Design Engineer Village Networks, Inc. [log in to unmask] --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------