As our designs get denser, we're using smaller and smaller vias
(.015 pad, .008 +.000/-.008 FHS in some cases) to gain more space;
yet it's still not enough. We're having to add additional layers
just to route some of the fine pitch BGA's.
We're trying to avoid blind/buried vias to keep costs down, but
is anyone out there using via-in-pad technology? On BGA's or
on everything? What size via are you using? Are you seeing any
cost increase (in fab/assembly/test processes)? If so, what
percentage increase can I expect? Thanks in advance for any info
you can provide.

********************
Alexis Meehan
PCB CAD Mgr.
408-328-4595
[log in to unmask]
570 Maude Court
Sunnyvale, CA 94085
http://www.luxn.com
LuxN - The Optical Renaissance has begun!(tm)

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