As our designs get denser, we're using smaller and smaller vias (.015 pad, .008 +.000/-.008 FHS in some cases) to gain more space; yet it's still not enough. We're having to add additional layers just to route some of the fine pitch BGA's. We're trying to avoid blind/buried vias to keep costs down, but is anyone out there using via-in-pad technology? On BGA's or on everything? What size via are you using? Are you seeing any cost increase (in fab/assembly/test processes)? If so, what percentage increase can I expect? Thanks in advance for any info you can provide. ******************** Alexis Meehan PCB CAD Mgr. 408-328-4595 [log in to unmask] 570 Maude Court Sunnyvale, CA 94085 http://www.luxn.com LuxN - The Optical Renaissance has begun!(tm) --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------