I am designing a board of 1.6mm thickness. When determining th
Hi All,

I am designing a board of 1.6mm thickness. When determining the layer stack-up I was asked to keep within 12layers for a greater yield in manufacturing. But I have seen 16layer stack-up for same thickness. Reasons I can think which can control the stack-up are, the impedance, placement complexity, routing requirements(delay length matching) and power planes (at the board level). I was wondering what stops to go for more layers if the prepreg and core with different thickness are available in market. 

Anyone has any insight what problems could rise in manufacturing on increasing the layers?

Thanks in advance for your suggestions.
Raj.



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