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August 2005

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Subject:
From:
Frank A Bergmeister <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Thu, 11 Aug 2005 10:33:56 -0400
Content-Type:
text/plain
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text/plain (19 lines)
I have a design with about 6 .5mm pitch bgas.  Only one pin inside of the
outer ring is being used.  How is everyone making the connection?  The
padstack for the bga is .0118 (per 7351).  I don't want to use via in pad
because the via is too big and ends up too close to the next pad.  I can
route .003 but it is an external layer so plating becomes an issue.  Plus
it's a class 3 design.  Love to hear what others are using for this size
bgas.

Frank

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