DESIGNERCOUNCIL Archives

1996

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uYv7A-0000FwC; Wed, 26 Jun 96 08:58 CDT
Content-Type:
text/plain; charset=us-ascii
CC:
[log in to unmask]
Old-Return-Path:
<[log in to unmask]>
Date:
Wed, 26 Jun 1996 10:06:15 -0400
Precedence:
list
Resent-From:
[log in to unmask]
Resent-Sender:
DesignerCouncil-request [log in to unmask]
MIME-Version:
1.0
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/1795
TO:
[log in to unmask]
Return-Path:
<DesignerCouncil-request>
X-Status:
X-Loop:
[log in to unmask]
From [log in to unmask] Wed Jun 26 13:
36:20 1996
Resent-Message-ID:
<"_Mtve2.0.Ox6.98Kqn"@ipc>
Subject:
DES: FAB: Heat Expansion
From:
[log in to unmask] (Doug McKean)
Content-Transfer-Encoding:
7bit
Message-ID:
<[log in to unmask]>
Organization:
Paragon Networks Inc.
X-Mailer:
Mozilla 2.0 (Win95; I)
Parts/Attachments:
text/plain (11 lines) 
Has anyone had problems with the different rates of expansion among IC
chips made of ceramic material, copper for traces/pads, and say FR4?

The result would be cracks in the traces/pads?

Doug

[log in to unmask]

ATOM RSS1 RSS2