回覆 : [TN] Photo Definable Dielectric Suppliers (1 Message)
"Lead Free", "The Great Gas-Out", and other musings.. (1 Message)
.75MM PITCH BGA (1 Message)
0201 component size usage (3 Messages)
1999 IPC Chip Scale and BGA National Symposium (1 Message)
8MM TAPE SPLICING TOOL FOR SMT CAPS&RES. (2 Messages)
: New Revision of NHB5300.4(3A-2) (3 Messages)
: Parylene Coating (1 Message)
: Toothpick test (2 Messages)
: Wave soldering CWR06 parts (2 Messages)
<No subject> (6 Messages)
A/B/C/D/E Technique in PCB manufacturing (1 Message)
Acceptable PCB Yields... (1 Message)
ADSL Technology (2 Messages)
ADSL technology... (1 Message)
Allowable PCA flex under/around BGAs (1 Message)
Anatech box/3 parameter Weibull (5 Messages)
ANSI Approval of IPC-2223 (1 Message)
Application of SAW filter chips (3 Messages)
Artwork storage (1 Message)
Assembly process differences between HASL and nic/gold surface finishe (1 Message)
Assembly process differences between HASL and nickel /go ld surface finishe (2 Messages)
Assembly process differences between HASL and nickel /gold surface finishe (1 Message)
Assembly process differences between HASL and nickel/gold surface finishe (1 Message)
ASSEMBLY: measling around pressfit flared hardware afte r wave solder (1 Message)
ASSEMBLY: measling around pressfit flared hardware after ... (1 Message)
ASSEMBLY: measling around pressfit flared hardware after wave solder (1 Message)
AXV DFM Guidelines recommendation - CAUTION !! (1 Message)
Baking of innerlayers (2 Messages)
Baking of polyimide boards (5 Messages)
Bar code label applicator (3 Messages)
bare boards with solder paste (7 Messages)
Bench top etcher (1 Message)
Best Manufacturing Practices (1 Message)
BGA and micro-BGA consumption distribution (8 Messages)
BGA Info. (1 Message)
BGA land design (1 Message)
BGA solder ball replacement options? (4 Messages)
BGA solder ball replacement options? -Reply (2 Messages)
BGA Via Fill (1 Message)
BGA Vias (2 Messages)
BGA Voiding Problem (4 Messages)
Blind Via Adhesion (3 Messages)
Boards sensitive to ESD (3 Messages)
Bow and Twist (3 Messages)
Break-in for capillary (1 Message)
Broadside Coupled Differential Lines (3 Messages)
Call for Papers ― IPCWorks '99 International Summit on Lead-Free Electronic Assemblies (1 Message)
Can adhesive go thru reflow soldering? (5 Messages)
Cascade(Seattle) Chapter Formation Meeting (1 Message)
CEM3 and surface mount (1 Message)
Change in current densities in a Macdermid Tin-lead bath (1 Message)
Chemical Testing Service in Georgia USA? (3 Messages)
Chip resistors upside down (2 Messages)
Clean Room Requirement (4 Messages)
Coax to P.C. board mounting (2 Messages)
Cold Solder/Rough Solder/Dull solder (1 Message)
Column Grid Arrays (CGA) (2 Messages)
Comments and Recommendations Requested for IPC-1730 (1 Message)
Comparative Tracking Index (CTI) on Circuit Board Mater ial (1 Message)
Comparative Tracking Index (CTI) on Circuit Board Material (1 Message)
computer upgrade (6 Messages)
Conductive Adhesive (3 Messages)
Conformal coat for Al wire bond (1 Message)
Contactless Electrical Tester (2 Messages)
Copper thickness measurement small PTH. (2 Messages)
CORFIN (1 Message)
Correct Spec for assembly of RF coaxial cable assemblies (1 Message)
Correction to JIT Training Resources... (1 Message)
Corrosion (5 Messages)
Cracked Tracks in a flex PCB (3 Messages)
Define goldfinger critical area (1 Message)
Definition of Microvias (4 Messages)
Design for manufacture (2 Messages)
Different current densities in the Macdermid tin-lead ba th (1 Message)
Different Paste Height (5 Messages)
DIP components (2 Messages)
DIP components addendum (1 Message)
DO-214AB/ SMCJ (3 Messages)
Double sided reflow (7 Messages)
Drying of double reflow boards with BGA's (1 Message)
DSA Anode (2 Messages)
DSC vs. TMA (4 Messages)
Electrolytic Plating (2 Messages)
Electrolytic plating on isolated areas or an alternative (2 Messages)
Entek question (2 Messages)
Fab-Laminate Material (1 Message)
File attachments (virus risk) (2 Messages)
Find out viclad laminate (1 Message)
Fine Pitch PADS (1 Message)
Fine-pitch PADs (3 Messages)
Flame Spray (2 Messages)
Flash Gold?? (5 Messages)
Flex stiffener (1 Message)
Flex stiffener -Reply (1 Message)
Gluing (1 Message)
Gold drag out reclaim (4 Messages)
Gold drag out reclaim - resins for... (1 Message)
Gold Embrittlement (6 Messages)
Gold embrittlement/Attaching Gold Plated leads to PWB's. (5 Messages)
Goldfinger questions. (2 Messages)
GRAINY JOINTS (5 Messages)
Halides in solderpaste (1 Message)
Hand Solder Pre-Heat (1 Message)
Heavy wire Al-bonding on FR4 (2 Messages)
Help for protective material of Thick Film (1 Message)
Help for protective material of Thick Film <IPC TN> (1 Message)
Hermitic Glass-to-Metal Sealing (1 Message)
High precision resistors (5 Messages)
Hot Air Knife (7 Messages)
How thin can a two layer board be? (6 Messages)
How to fill Vias? ... (4 Messages)
How to get water out? (1 Message)
How to Import. -Reply (1 Message)
Impedance Measurements of Solder Paste (2 Messages)
Insulator under a Xformer (1 Message)
Intermetallic growth during thermal cycling (1 Message)
Intermittent PCB Traces Due To Vibration (1 Message)
ionic contamination (4 Messages)
Ionic Contamination Testers (2 Messages)
IPC SPECIFICATION (1 Message)
IPC Standards (2 Messages)
IPC-4101 ANSI Approval (1 Message)
IPC/DC Greater Boston Chapter Meeting 04/21 6pm - SI (1 Message)
IPCchat session announcement (1 Message)
ISO Qualification (1 Message)
Isolator (5 Messages)
Japnese Manufacturer (3 Messages)
Japnese Manufacturer -Reply (1 Message)
JIT Training demo.... (4 Messages)
kapton coverlay (3 Messages)
kapton flex circuits (2 Messages)
Kapton Flex Circuits Reliablity Assurance (1 Message)
Kleenox (1 Message)
Label Feeder (1 Message)
Laminate, No UV Block. (2 Messages)
Land Grid Array and Pad Size (1 Message)
Land Pattern for 24 ld SSOP (2 Messages)
Lead-Free Alloys (2 Messages)
Lead-to-Hole Ratio (1 Message)
Life testing of PCBAs. (2 Messages)
Linux in a CIM Environment? (2 Messages)
Method 2.6.22 Acoustic Microscopy (3 Messages)
Michigan DC Chapter meeting (1 Message)
Microetch depth measurement (5 Messages)
MIL-P-55110 continuance (1 Message)
Milled Finish??? (1 Message)
Moisture absorption in plastic packaging (1 Message)
Multilayer drilling (1 Message)
New surface coating (finish) (1 Message)
Ni Plating for wire bond (2 Messages)
Ni/Au "black pad" problem (1 Message)
Nickel Chromium Etchant (1 Message)
North Penn Technologies (1 Message)
North Penn Techologies (5 Messages)
Optical Comparators (2 Messages)
Order standard (1 Message)
Oxidation on a Connector (2 Messages)
Oxide reducing powder (2 Messages)
Part number systems (3 Messages)
Parylene coating (2 Messages)
Pb in conductor-paste (2 Messages)
PBGA357 (2 Messages)
PC501 solder mask? (2 Messages)
PCB (1 Message)
PCB discoloration (2 Messages)
PCB Scoreline (V cut) tolerance (7 Messages)
PCI Connector P/S insufficient after Wave (3 Messages)
Photo Definable Dielectric Suppliers (1 Message)
Pitting (6 Messages)
plating pens (4 Messages)
plating thickness (2 Messages)
Polyimide tape applicator. (1 Message)
Popcorning (1 Message)
Popcorning <IPC TN> (2 Messages)
Positive & negative etchback (1 Message)
Power Drivers... (4 Messages)
Problem during strip dry film (6 Messages)
PROCESS PROBLEM (2 Messages)
protective films (1 Message)
Prototype board for BGA's (1 Message)
PWB: Kapton or similar process (1 Message)
Quad 100 (2 Messages)
Question from customer (7 Messages)
Question from customer - Dichloromethane (1 Message)
Question: Problems in BGA assembly process... (1 Message)
Question: Problems in BGA assembly process... <IPC TN> (1 Message)
Re-entrant flow simulation (1 Message)
Recommendations on a Versatile Microsectioning System? (3 Messages)
reflow solder defect (1 Message)
Reflowing ceramic boards. (2 Messages)
ReGold (1 Message)
Repair's Adverse Effect (5 Messages)
Revision change costs (7 Messages)
Rework technology inquiry (4 Messages)
Salary Survey for PCB Designers (2 Messages)
Samurai (4 Messages)
SBU (1 Message)
selecting coatings (2 Messages)
Selective negative etchback on a 10 layer board (4 Messages)
Sensby Conveyors (1 Message)
Sensby Conveyors. (3 Messages)
Sensby Conveyors. -Reply (1 Message)
shadowing of SMD in wave solder (1 Message)
SMT Chip Resistors (2 Messages)
SMT Component Fall Out Rate (3 Messages)
Sn/Ag Solder (5 Messages)
SNEC April meeting notice (1 Message)
SNEC mtg notice (1 Message)
Solder filled vias (3 Messages)
Solder Mask Adhesion (Tape test) (3 Messages)
Solderability Testing (3 Messages)
SOLDERING A CAP (1 Message)
Soldering Book Wanted (1 Message)
soldering Connector (6 Messages)
Soldering Paladium-Silver-Platinum terminations (2 Messages)
Soldering straddle mount connectors and other stuff... (2 Messages)
Soldering to Brass (1 Message)
Soldermask off-rework options (4 Messages)
Something off-topic... (1 Message)
Sources for Rigid/Flex circuits (2 Messages)
SPC (2 Messages)
Specifying DIFFERENTIAL Impedance (4 Messages)
Stain in Palladium based DPS (2 Messages)
Stop sending e-mail (1 Message)
Subcribe (1 Message)
subscribe (2 Messages)
subscribe technet (1 Message)
Substrate X-OUT (1 Message)
Substrates / Tooling Charges (1 Message)
Switching power supply (2 Messages)
test-phenom (3 Messages)
Thanks! (was RE: [TN] Chemical Testing Service in Georgia USA?) (1 Message)
Theda Service Bureau (1 Message)
Thermocouple Attachment Methods (4 Messages)
Thermocouple welders (1 Message)
Thermocouples on Hard Drives (5 Messages)
Tin stripper on line recycle (3 Messages)
Titanium Lead Cropping Plates (1 Message)
Traces (6 Messages)
Type of files required for Test Fixtures. (2 Messages)
URGENT !!! San Diego Update!!! (1 Message)
US IRS and ODX-TAX (1 Message)
Use of CAM350 (1 Message)
V-Tek Tape and Reel Machines... (1 Message)
Vibratory Feeders (3 Messages)
VME 64X (1 Message)
Wage and Salary (3 Messages)
Warp and Twist (1 Message)
Water (2 Messages)
Wave Solder Ventilation (1 Message)
weekcode (6 Messages)
Wire Bond, in over in our heads (1 Message)
Wire Bonding On Gold (7 Messages)
[CHIPNET] Metal Polyimide Adhesion (1 Message)
[CN] BGAs (1 Message)
[Fwd: FW: Turn On Your Lights For Littleton CO] (1 Message)
[TN] 8MM TAPE SPLICING TOOL FOR SMT CAPS&RES. (1 Message)
[TN] Black Ni/Au pads (2 Messages)
[TN] Blind Via Adhesion (1 Message)
[TN] Can adhesive go thru reflow soldering? (1 Message)
[TN] DIP components (1 Message)
[TN] Electrolytic plating on isolated areas or an alt (1 Message)
[TN] SMT Component Fall Out Rate (1 Message)
[TN] Specifying DIFFERENTIAL Impedance (1 Message)
[TN] weekcode (1 Message)