TECHNET Archives

May 2016

TechNet@IPC.ORG
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Bev Christian (1 Message)
Bhanu Sood (2 Messages)
Bush, Brien (1 Message)
Carl Van Wormer (1 Message)
Carroll, Thomas A (2 Messages)
Chris BALL (2 Messages)
David Hillman (6 Messages)
Deng RongJun (1 Message)
Dennis Fritz (1 Message)
Doug Schueller (1 Message)
Douglas Pauls (2 Messages)
Ed Popielarski (3 Messages)
George Wenger (2 Messages)
Giamis, Andy (1 Message)
Graham Naisbitt (1 Message)
Grossmann, Günter (2 Messages)
Guy Ramsey (2 Messages)
Ioan Tempea (2 Messages)
John Burke (4 Messages)
Jonathan Griffiths (1 Message)
Karl Loh (2 Messages)
Kuczynski, Michael (1 Message)
Larry Dzaugis (1 Message)
Louis Hart (1 Message)
Lum Wee Mei (1 Message)
Matthias Mansfeld (1 Message)
McGlaughlin, Jeffrey A (1 Message)
Mike Fenner (1 Message)
Nutting, Phil (1 Message)
Richard Kraszewski (2 Messages)
Richard Snogren (1 Message)
Sandy Gentry (1 Message)
Stadem, Richard D. (6 Messages)
stephen gregory (1 Message)
Steve Gregory (1 Message)
Tan Geok Ang (2 Messages)
Theodore J. Tontis (1 Message)
Upton, Shawn (1 Message)
Victor Hernandez (5 Messages)
Vladimir (3 Messages)
Yuan-chia Joyce Koo (8 Messages)
Zilber Gil (3 Messages)

Subject

From Sorted by Sender, Alphabetically

Date
New Sender Bev Christian
Pad Cratering and Dye and Pry
Bev Christian
Thu, 26 May 2016 07:13:25 -0400
New Sender Bhanu Sood
Re: Method to clear bare PCB inner layer shorts?
Bhanu Sood
Sat, 21 May 2016 15:45:19 -0400
Re: Pad Cratering and Dye and Pry
Bhanu Sood
Thu, 26 May 2016 07:56:14 -0400
New Sender Bush, Brien
Re: How much change is change?
Bush, Brien
Thu, 26 May 2016 15:19:02 +0000
New Sender Carl Van Wormer
Re: Method to clear bare PCB inner layer shorts?
Carl Van Wormer
Fri, 20 May 2016 19:51:20 +0000
New Sender Carroll, Thomas A
Re: Press-fit inspection
Carroll, Thomas A
Mon, 9 May 2016 12:38:12 +0000
Re: Press-fit inspection
Carroll, Thomas A
Mon, 9 May 2016 12:42:09 +0000
New Sender Chris BALL
what is acceptable % of copper leaching in barrel and pad
Chris BALL
Mon, 16 May 2016 16:50:55 -0500
Re: what is acceptable % of copper leaching in barrel and pad
Chris BALL
Tue, 24 May 2016 12:25:50 -0500
New Sender David Hillman
Re: Alpha ROSIN (ROL1) Test Flux
David Hillman
Wed, 11 May 2016 07:33:11 -0500
Re: AW: [TN] Intermetallic and high temperature operation
David Hillman
Fri, 20 May 2016 06:53:02 -0500
Re: How much change is change?
David Hillman
Thu, 26 May 2016 10:07:05 -0500
Re: Intermetallic and high temperature operation
David Hillman
Thu, 19 May 2016 08:11:52 -0500
Re: Intermetallic and high temperature operation
David Hillman
Thu, 19 May 2016 10:21:39 -0500
Re: what is acceptable % of copper leaching in barrel and pad
David Hillman
Tue, 17 May 2016 17:25:18 -0500
New Sender Deng RongJun
Press-fit inspection
Deng RongJun
Mon, 9 May 2016 12:34:26 +0000
New Sender Dennis Fritz
Re: How much change is change?
Dennis Fritz
Thu, 26 May 2016 14:50:55 -0400
New Sender Doug Schueller
Assistance in MIL-PRF-31032 qualification
Doug Schueller
Wed, 11 May 2016 20:30:15 +0000
New Sender Douglas Pauls
How much change is change?
Douglas Pauls
Thu, 26 May 2016 09:59:48 -0500
Re: How much change is change?
Douglas Pauls
Thu, 26 May 2016 10:14:39 -0500
New Sender Ed Popielarski
Re: How much change is change?
Ed Popielarski
Thu, 26 May 2016 15:07:21 +0000
Re: what is acceptable % of copper leaching in barrel and pad
Ed Popielarski
Mon, 16 May 2016 22:41:55 +0000
Re: what is acceptable % of copper leaching in barrel and pad
Ed Popielarski
Tue, 24 May 2016 17:34:55 +0000
New Sender George Wenger
Re: ENIG Board Finish with Tin Plated hardware
George Wenger
Mon, 30 May 2016 03:31:55 +0000
Re: what is acceptable % of copper leaching in barrel and pad
George Wenger
Tue, 17 May 2016 00:23:35 +0000
New Sender Giamis, Andy
Re: ENIG Board Finish with Tin Plated hardware
Giamis, Andy
Fri, 27 May 2016 15:06:26 +0000
New Sender Graham Naisbitt
Re: Alpha ROSIN (ROL1) Test Flux
Graham Naisbitt
Thu, 12 May 2016 11:58:07 +0100
New Sender Grossmann, Günter
AW: [TN] Intermetallic and high temperature operation
Grossmann, Günter
Fri, 20 May 2016 07:10:59 +0000
AW: [TN] Pad Cratering and Dye and Pry
Grossmann, Günter
Thu, 26 May 2016 14:51:15 +0000
New Sender Guy Ramsey
Re: How much change is change?
Guy Ramsey
Thu, 26 May 2016 15:18:02 -0400
Re: J-STD-005
Guy Ramsey
Wed, 4 May 2016 09:34:03 -0400
New Sender Ioan Tempea
Re: Alpha ROSIN (ROL1) Test Flux
Ioan Tempea
Wed, 11 May 2016 12:48:43 +0000
Conductive epoxy printing process
Ioan Tempea
Fri, 6 May 2016 19:00:42 +0000
New Sender John Burke
Re: IPC APEX EXPO 2017 Call for Participation
John Burke
Fri, 13 May 2016 11:10:23 -0700
Re: Pad Cratering and Dye and Pry
John Burke
Thu, 26 May 2016 07:07:11 -0700
Senju M770 alloy
John Burke
Fri, 13 May 2016 11:11:50 -0700
Re: what is acceptable % of copper leaching in barrel and pad
John Burke
Mon, 16 May 2016 17:41:10 -0700
New Sender Jonathan Griffiths
Re: Alpha ROSIN (ROL1) Test Flux
Jonathan Griffiths
Thu, 12 May 2016 10:58:50 +0000
New Sender Karl Loh
Re: .031 PCB and WLCSP
Karl Loh
Fri, 13 May 2016 14:44:01 -0500
Re: BGA Underfill material
Karl Loh
Fri, 13 May 2016 13:42:08 -0500
New Sender Kuczynski, Michael
ENIG Board Finish with Tin Plated hardware
Kuczynski, Michael
Fri, 27 May 2016 14:43:42 +0000
New Sender Larry Dzaugis
Re: How much change is change?
Larry Dzaugis
Thu, 26 May 2016 12:40:14 -0500
New Sender Louis Hart
Re: How much change is change?
Louis Hart
Fri, 27 May 2016 18:18:59 +0000
New Sender Lum Wee Mei
Daughter Card and Backplane Impedancne Control Interface
Lum Wee Mei
Tue, 31 May 2016 00:38:28 +0000
New Sender Matthias Mansfeld
Re: Method to clear bare PCB inner layer shorts?
Matthias Mansfeld
Fri, 20 May 2016 23:17:11 +0300
New Sender McGlaughlin, Jeffrey A
Re: Solderless wire Crimp terminal, Industry Standards
McGlaughlin, Jeffrey A
Thu, 12 May 2016 14:54:02 +0000
New Sender Mike Fenner
Re: How much change is change?
Mike Fenner
Fri, 27 May 2016 10:59:51 +0100
New Sender Nutting, Phil
Re: ENIG Board Finish with Tin Plated hardware
Nutting, Phil
Fri, 27 May 2016 15:32:15 +0000
New Sender Richard Kraszewski
Re: Alpha ROSIN (ROL1) Test Flux
Richard Kraszewski
Wed, 11 May 2016 15:00:28 +0000
Re: How much change is change?
Richard Kraszewski
Sun, 29 May 2016 18:19:43 +0000
New Sender Richard Snogren
i found the stuff
Richard Snogren
Wed, 18 May 2016 04:10:44 +0300
New Sender Sandy Gentry
IPC APEX EXPO 2017 Call for Participation
Sandy Gentry
Thu, 12 May 2016 14:47:49 -0500
New Sender Stadem, Richard D.
Re: ENIG Board Finish with Tin Plated hardware
Stadem, Richard D.
Tue, 31 May 2016 11:42:56 +0000
Re: How much change is change?
Stadem, Richard D.
Thu, 26 May 2016 15:11:21 +0000
Re: How much change is change?
Stadem, Richard D.
Thu, 26 May 2016 15:41:07 +0000
J-STD-005
Stadem, Richard D.
Wed, 4 May 2016 13:14:20 +0000
Re: Press-fit inspection
Stadem, Richard D.
Mon, 9 May 2016 14:06:33 +0000
Re: Press-fit inspection
Stadem, Richard D.
Mon, 9 May 2016 14:09:18 +0000
New Sender stephen gregory
Method to clear bare PCB inner layer shorts?
stephen gregory
Fri, 20 May 2016 18:08:35 +0000
New Sender Steve Gregory
Re: what is acceptable % of copper leaching in barrel and pad
Steve Gregory
Mon, 16 May 2016 16:08:45 -0600
New Sender Tan Geok Ang
Re: ENIG Board Finish with Tin Plated hardware
Tan Geok Ang
Mon, 30 May 2016 02:44:50 +0000
Re: ENIG Board Finish with Tin Plated hardware
Tan Geok Ang
Tue, 31 May 2016 00:33:02 +0000
New Sender Theodore J. Tontis
Re: How much change is change?
Theodore J. Tontis
Thu, 26 May 2016 18:09:31 +0000
New Sender Upton, Shawn
Re: Daughter Card and Backplane Impedancne Control Interface
Upton, Shawn
Tue, 31 May 2016 13:00:55 +0000
New Sender Victor Hernandez
Alpha ROSIN (ROL1) Test Flux
Victor Hernandez
Wed, 11 May 2016 12:26:47 +0000
Re: Pad Cratering and Dye and Pry
Victor Hernandez
Thu, 26 May 2016 12:11:32 +0000
Re: Pad Cratering and Dye and Pry
Victor Hernandez
Thu, 26 May 2016 12:12:15 +0000
Re: Press-fit inspection
Victor Hernandez
Mon, 9 May 2016 12:44:17 +0000
Solderless wire Crimp terminal, Industry Standards
Victor Hernandez
Thu, 12 May 2016 14:21:43 +0000
New Sender Vladimir
Re: Intermetallic and high temperature operation
Vladimir
Thu, 19 May 2016 11:04:51 -0400
Re: Intermetallic and high temperature operation
Vladimir
Thu, 19 May 2016 11:27:52 -0400
Re: Pad Cratering and Dye and Pry
Vladimir
Thu, 26 May 2016 14:33:41 +0300
New Sender Yuan-chia Joyce Koo
Re: ENIG Board Finish with Tin Plated hardware
Yuan-chia Joyce Koo
Fri, 27 May 2016 11:47:06 -0400
Re: ENIG Board Finish with Tin Plated hardware
Yuan-chia Joyce Koo
Mon, 30 May 2016 08:16:57 -0400
Re: ENIG Board Finish with Tin Plated hardware
Yuan-chia Joyce Koo
Mon, 30 May 2016 08:36:47 -0400
Re: How much change is change?
Yuan-chia Joyce Koo
Thu, 26 May 2016 11:36:50 -0400
Re: How much change is change?
Yuan-chia Joyce Koo
Sun, 29 May 2016 19:54:27 -0400
Re: Intermetallic and high temperature operation
Yuan-chia Joyce Koo
Thu, 19 May 2016 09:46:00 -0400
Re: Intermetallic and high temperature operation
Yuan-chia Joyce Koo
Thu, 19 May 2016 11:22:02 -0400
Re: Pad Cratering and Dye and Pry
Yuan-chia Joyce Koo
Thu, 26 May 2016 08:08:34 -0400
New Sender Zilber Gil
Intermetallic and high temperature operation
Zilber Gil
Thu, 19 May 2016 12:34:07 +0000
Re: Intermetallic and high temperature operation
Zilber Gil
Thu, 19 May 2016 14:54:10 +0000
Re: Intermetallic and high temperature operation
Zilber Gil
Thu, 19 May 2016 15:44:08 +0000

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