I just submitted this abstract anyone on TechNet want to work with me on this as I have the original work but feel that there may be others out there on the same track?
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Reflow profiling - a more scientific approach by applying a mathematical equation to the reflow profile
Reflow profiling has been through a number of innovations over the years. From the ECD mole through to the KIC in line systems, engineers have been trying to understand and control the heating profile for their products.
Generally though the only consideration is the shape of the profile, TAL, Pre-heat, slope, peak temperature, mostly from a bare board or a board with scrap components. The output may then be put through a prediction algorithm for adjusting oven settings.
This paper presents a more scientific approach demanded by ever denser modern assemblies.
The author has developed a system of translating the output from the profiling data logger into a mathematical equation.
Once the profile is in the form of a mathematical model, it is very easy to understand the impact of adjusting various parts of the profile as it is now possible using relatively simple software to integrate various parts of the reflow profile and to understand energy uptake into the assembly being profiled.
This is critically important in enterprise level electronics. In enterprise products the requirement is for the final assembly to survive 1000+ thermal cycles to a JEDEC specification. This cycling generally takes around 6 weeks so with the time compression on modern time to market schedules it is essential that the engineering team KNOW that the assembly will pass the specification.
The paper describes the work done on profiling which achieved 1750+ thermal cycles after this system was implemented compared to a 750 cycle fail condition, only the profile being changed.
The system also allows for a high degree of correlation between a bare and a fully loaded board and allows correlation between different product families and their behavior during the reflow process.
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