TGASIA Archives

February 2012

TGAsia@IPC.ORG

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保险元件热缩套管作用 (3 Messages)
化学沉锡工艺 (1 Message)
咨询: 喷锡HASL PCB焊盘发黄 (2 Messages)
回复: Re: [TGAsia]请教清理锡珠的工具 (1 Message)
回覆: [TGAsia] 请教消除锡球的方案 (1 Message)
烙铁头的对地电阻 (2 Messages)
焊锡断裂 (4 Messages)
答复: 答复: electrochemical corrosion through solder ask crack油墨(防焊剂)引起的电化学腐资料/技术文章 (1 Message)
答复: electrochemical corrosion through solder ask crack油墨(防焊剂)引起的电化学腐资料/技术文章 (3 Messages)
答复: [TGAsia] 答复: electrochemical corrosion through solder ask crack油墨(防焊剂)引起的电化学腐资料/技术文章 (1 Message)
答复: [TGAsia] Non-clean Flux Residue (1 Message)
答复: [TGAsia] PCB线路密度/宽度与通过电流的关系 (1 Message)
答复: [TGAsia] Tin Whisker锡须相关问题 (1 Message)
致IPC 5-45CN工作组全体成员-关于援引IPC-9853标准草案稿 (1 Message)
誰可以分享SMT廠之SPC作法? (1 Message)
请教消除锡球的方案 (3 Messages)
贴片料保质期 (1 Message)
關于PCB掉PAD﹐請大家幫忙 (2 Messages)
IMC厚度 (1 Message)
IMC 厚度 (1 Message)
IPC 2012年CEMAC,WorksAsia 征集演讲论文!!火爆招募中! (1 Message)
IPC610E 5.2.6 (2 Messages)
Nano nickel 药水或工艺 (2 Messages)
Non-clean Flux Residue (7 Messages)
PCB线路密度/宽度与通过电流的关系 (1 Message)
PCB Exposure Copper (1 Message)
Solder Mask Coating (8 Messages)
Solder mask thickness (1 Message)
Tin Whisker锡须相关问题 (1 Message)
White Residue on Gold pad surface (1 Message)

Subject Sorted by Subject, Most Recent First

From

Date

New Thread 保险元件热缩套管作用
john
Thu, 9 Feb 2012 00:19:38 +0800
guoch
Thu, 9 Feb 2012 08:53:59 +0800
john
Fri, 10 Feb 2012 12:22:07 +0800
New Thread 化学沉锡工艺
Owen Zhou
Thu, 23 Feb 2012 20:05:03 -0500
New Thread 咨询: 喷锡HASL PCB焊盘发黄
bo.xu
Fri, 17 Feb 2012 11:06:23 +0800
Justin Wu
Fri, 17 Feb 2012 11:32:33 +0800
New Thread 回复: Re: [TGAsia]请教清理锡珠的工具
chenyouzhen
Sat, 18 Feb 2012 22:02:40 +0800
New Thread 回覆: [TGAsia] 请教消除锡球的方案
Tang Xianjun
Mon, 20 Feb 2012 01:19:26 +0000
New Thread 烙铁头的对地电阻
Lu Chunli
Thu, 16 Feb 2012 16:48:52 +0800
Gordon Gu(��浩_PSZ)
Thu, 16 Feb 2012 09:05:29 +0000
New Thread 焊锡断裂
Thomas Wang
Mon, 20 Feb 2012 13:14:48 +0800
Andrew Yu-0108CE
Mon, 20 Feb 2012 13:50:42 +0800
QA-李曼[Raymond]
Mon, 20 Feb 2012 14:21:01 +0800
Thomas Wang
Tue, 21 Feb 2012 08:46:23 +0800
New Thread 答复: 答复: electrochemical corrosion through solder ask crack油墨(防焊剂)引起的电化学腐资料/技术文章
R.Chen[陈榕]
Thu, 1 Mar 2012 11:34:23 +0800
New Thread 答复: electrochemical corrosion through solder ask crack油墨(防焊剂)引起的电化学腐资料/技术文章
R.Chen[陈榕]
Thu, 1 Mar 2012 10:39:50 +0800
Ken Chow
Thu, 1 Mar 2012 11:28:45 +0800
QA-李曼[Raymond]
Thu, 1 Mar 2012 11:59:12 +0800
New Thread 答复: [TGAsia] 答复: electrochemical corrosion through solder ask crack油墨(防焊剂)引起的电化学腐资料/技术文章
Liu Qiang(刘强) CTI
Thu, 1 Mar 2012 11:51:01 +0800
New Thread 答复: [TGAsia] Non-clean Flux Residue
<>
Wed, 15 Feb 2012 15:12:11 +0800
New Thread 答复: [TGAsia] PCB线路密度/宽度与通过电流的关系
Rong XIAO
Thu, 9 Feb 2012 01:25:56 +0000
New Thread 答复: [TGAsia] Tin Whisker锡须相关问题
Bliver Zhang
Thu, 9 Feb 2012 02:14:35 +0000
New Thread 致IPC 5-45CN工作组全体成员-关于援引IPC-9853标准草案稿
Rong XIAO
Wed, 8 Feb 2012 07:34:50 +0000
New Thread 誰可以分享SMT廠之SPC作法?
Bright cao
Tue, 7 Feb 2012 16:22:00 +0800
New Thread 请教消除锡球的方案
chenyouzhen
Sat, 18 Feb 2012 23:18:01 +0800
guoch
Sun, 19 Feb 2012 12:17:54 +0800
李哲
Sun, 19 Feb 2012 21:43:47 +0800
New Thread 贴片料保质期
李蓓蓓
Sat, 18 Feb 2012 13:59:34 +0800
New Thread 關于PCB掉PAD﹐請大家幫忙
William S.G. Wu
Mon, 20 Feb 2012 17:01:47 +0800
William S.G. Wu
Mon, 20 Feb 2012 17:05:07 +0800
New Thread IMC厚度
hua.shui
Wed, 1 Feb 2012 16:21:30 +0800
New Thread IMC 厚度
Owen Zhou
Wed, 1 Feb 2012 03:16:31 -0500
New Thread IPC 2012年CEMAC,WorksAsia 征集演讲论文!!火爆招募中!
Paul ZONG
Fri, 17 Feb 2012 06:33:10 +0000
New Thread IPC610E 5.2.6
BU1/GMT/ENG-HM Wei Jian Kang
Wed, 22 Feb 2012 05:53:21 +0000
BU1/GMT/ENG-HM Wei Jian Kang
Thu, 1 Mar 2012 00:53:54 +0000
New Thread Nano nickel 药水或工艺
Gaixian Sun(质保经理孙该贤)
Fri, 10 Feb 2012 08:38:49 +0800
Ken Chow
Thu, 1 Mar 2012 00:38:35 +0800
New Thread Non-clean Flux Residue
Roger Liu
Wed, 15 Feb 2012 09:00:36 +0800
Eidde Yang
Wed, 15 Feb 2012 09:07:54 +0800
Lu Chunli
Wed, 15 Feb 2012 09:15:59 +0800
czd
Wed, 15 Feb 2012 09:23:25 +0800
Jiazhao Ling
Wed, 15 Feb 2012 09:29:20 +0800
严峰
Wed, 15 Feb 2012 09:38:14 +0800
Roger Liu
Wed, 15 Feb 2012 09:49:24 +0800
New Thread PCB线路密度/宽度与通过电流的关系
bo.xu
Thu, 9 Feb 2012 08:52:38 +0800
New Thread PCB Exposure Copper
Jison Shen(DD&TT)
Thu, 16 Feb 2012 15:05:35 +0800
New Thread Solder Mask Coating
Justin Wu
Thu, 16 Feb 2012 11:35:16 +0800
Joseph Ho
Thu, 16 Feb 2012 12:03:29 +0800
Justin Wu
Thu, 16 Feb 2012 12:08:33 +0800
Joseph Ho
Thu, 16 Feb 2012 12:15:13 +0800
Justin Wu
Thu, 16 Feb 2012 12:35:23 +0800
Joseph Ho
Thu, 16 Feb 2012 14:00:26 +0800
Justin Wu
Thu, 16 Feb 2012 14:12:48 +0800
Jiazhao Ling
Thu, 16 Feb 2012 14:24:47 +0800
New Thread Solder mask thickness
Frank Lan
Thu, 9 Feb 2012 07:51:45 +0000
New Thread Tin Whisker锡须相关问题
bo.xu
Thu, 9 Feb 2012 08:50:28 +0800
New Thread White Residue on Gold pad surface
zhangyanping
Sat, 4 Feb 2012 14:16:22 +0800

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