% of Medical that is Pb-Free (1 Message)
0.4mm, 0.5mm interposer / adaptor boards? (2 Messages)
2nd request percent of industry using no-clean flux (2 Messages)
Air bubble in solder resist (3 Messages)
APEX/EXPO Workshops (1 Message)
Baking PWB's to remove moisture (2 Messages)
Bent leads on CCGA - Inspect with Panasonic CM602 (4 Messages)
BGA underfill opens- the saga continues (9 Messages)
Bottom side SMT adhesives (18 Messages)
CAF resistant design guide?? (2 Messages)
Catch up with the latest IPC has to offer! (1 Message)
Check this out (3 Messages)
Coating (6 Messages)
Coffin-Manson (4 Messages)
copper adhesion to ceramic substrate (4 Messages)
CPK (1 Message)
Decomposition Temperature (1 Message)
Dougs articles on cleanliness (2 Messages)
ECM or SIR - What Electrical test is best? (5 Messages)
EU "simplification" (4 Messages)
FEM to include the intermetallic layer! (3 Messages)
Fiji AIM users and PPDplus (2 Messages)
galvanic compatibility (10 Messages)
Henry Rekers is out of the office. (1 Message)
hi-temp solder requirements (2 Messages)
Humiseal UV40 Conformal Coating (8 Messages)
Image of a B25 test Board (2 Messages)
Implementing Measures of the Korean RoHS Act Out in December 2007 (1 Message)
Informal Poll (3 Messages)
IPC 6013 (2 Messages)
IPC call for nominations for awards - deadline is February 5, 2008 (1 Message)
IPC International Conference on Flexible Circuits, February 12 - 14, 2008, Phoenix, Ariz, (1 Message)
IPC International Conference on Flexible Circuits, February 12-14, 2008, Phoenix, Ariz. (1 Message)
IPC Workshop: Design for Manufacture, Assembly and Test, Hosted by Hunter Technology - Santa Clara, Calif., February 26-27, 2008 (1 Message)
ipc-6012B amendement (4 Messages)
IPC-6013 final finish Class 1 or class 2 [FLEX] (2 Messages)
IPC/JEDEC International Conference on Reliability, Rework and Repair of Lead-Free Electronics, March 11-12, 2008, Raleigh, N.C. (1 Message)
IST for lead free assembly PCB monitoring (5 Messages)
Join IPC at one of their upcoming events in California! (1 Message)
Join IPC at one of their upcoming webcasts and get the latest information on these topics! (1 Message)
Join IPC at their upcoming workshops in San Jose, CA! (1 Message)
L0 flux classification (4 Messages)
laser carbon residue (8 Messages)
Lead-free HASL finishes (6 Messages)
liquid imageable soldmask (8 Messages)
Looking for Coating Comparison (9 Messages)
Microvoids immersion silver (24 Messages)
Module Quality Question (2 Messages)
Molded silicone thermal sheets (5 Messages)
More AuSn needle and platelet photos... (4 Messages)
MSDS for women (1 Message)
MURPHY'S OTHER LAWS (6 Messages)
MURPHY'S OTHER LAWS NTC (7 Messages)
NTC Little bird "kooing" (12 Messages)
NTC Solderability of Tin-Gold Intermetallic (1 Message)
OSP w selective gold (18 Messages)
Outgassing requirements and Polyimide material (1 Message)
percent of industry using no-clean flux (1 Message)
PolyChlorinated Bipheyl (1 Message)
Polyester Dome Switch on Flex Circuit. (5 Messages)
Randall L Bock/MSD/US/PBI is out of the office. (2 Messages)
Raw PCB Insulation Resistance Test (1 Message)
Recall: [TN] Used Equipment Sales (1 Message)
Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders (11 Messages)
reflow soldering metal backed pcb (6 Messages)
Solder fines (3 Messages)
Solder thieves (6 Messages)
Solderability of Tin-Gold Intermetallic (13 Messages)
Solderability of Tin-Gold Intermetallic NTC (19 Messages)
Solderability of Tin-Gold Intermetallic NTC Flash Floods Kill (2 Messages)
Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion... (3 Messages)
Solderability of Tin-Gold Intermetallic, summing up (2 Messages)
Soldering of Gold Finishes Reference (1 Message)
Source for TO-5 cans for packaging custom components (2 Messages)
specifying board cleanliness (21 Messages)
Squeegee Studies (4 Messages)
SV: [TN] Coffin-Manson (4 Messages)
SV: [TN] copper adhesion to ceramic substrate (1 Message)
SV: [TN] EU "simplification" (1 Message)
SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders (5 Messages)
SV: [TN] reflow soldering metal backed pcb (1 Message)
SV: [TN] Solder fines (3 Messages)
SV: [TN] Solderability of Tin-Gold Intermetallic (4 Messages)
SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic (62 Messages)
SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic - Hybrid Vehicles (2 Messages)
SV: [TN] Warpage of components (9 Messages)
TechNet Digest - 2 Jan 2008 to 3 Jan 2008 (#2008-3) (1 Message)
Terry L Huddleston/ElecTec/Teledyne is out of the office. (1 Message)
through hole current carrying capacity (2 Messages)
Upcoming IPC events you should miss! Register today! (6 Messages)
Upcoming IPC workshops in Bannockburn, Illinois! (1 Message)
Upcoming IPC workshops on printed board technology! (1 Message)
Used Equipment Sales (10 Messages)
Warpage of components (13 Messages)
Wedge bonds (4 Messages)
[KECE] Further implementing guidance on Korea RoHS/ELV delivered quickly (1 Message)
[LF] Korea RoHS Update (sort of) (2 Messages)
[LF] RoHS stakeholder consultation launched (1 Message)
[TN] Air bubble in solder resist (6 Messages)
[TN] EU "simplification" (1 Message)