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Subject	From	Date
IPC HDI Standards	Hernandez, Victor G	Fri, 24 Feb 2023 14:08:40 +0000
Re: Solder in the lead bend	Gumpert, Ben	Thu, 16 Feb 2023 13:49:27 +0000
Re: Solder in the lead bend	Guy Ramsey	Wed, 15 Feb 2023 08:06:47 -0500
Re: Solder in the lead bend	Bush, Jeffrey D. (US)	Tue, 14 Feb 2023 16:16:48 +0000
Re: Solder in the lead bend	[log in to unmask]	Tue, 14 Feb 2023 16:09:59 +0000
Re: Solder in the lead bend	[log in to unmask]	Tue, 14 Feb 2023 16:00:54 +0000
Re: Solder in the lead bend	Bush, Jeffrey D. (US)	Tue, 14 Feb 2023 15:57:36 +0000
Solder in the lead bend	Gumpert, Ben	Tue, 14 Feb 2023 15:16:36 +0000
Re: Edge Bond	Peter Swanson	Mon, 13 Feb 2023 19:42:59 +0000
Re: Edge Bond	Bush, Jeffrey D. (US)	Mon, 13 Feb 2023 17:45:09 +0000
R: Edge Bond	Francesco Di Maio	Mon, 13 Feb 2023 17:08:01 +0000
Edge Bond	<>	Mon, 13 Feb 2023 15:29:43 +0000
Re: Cool - Caps ????	Tempea, Ioan	Tue, 7 Feb 2023 21:19:22 +0000
Cool - Caps ????	Richard Kraszewski	Tue, 7 Feb 2023 21:04:57 +0000
Re: Reflow Encapsulant ????	Tan Geok Ang	Mon, 6 Feb 2023 06:01:43 +0000
Reflow Encapsulant ????	Richard Kraszewski	Fri, 3 Feb 2023 20:58:02 +0000
Re: Most Current NASA Outgassing List of Tested Polymetric Materials	Bush, Jeffrey D. (US)	Thu, 2 Feb 2023 15:12:23 +0000
Re: Thermal cycling of epoxy attached components	Bush, Jeffrey D. (US)	Thu, 2 Feb 2023 15:04:57 +0000