George, There is a system in place that is being utilized by some of the top manufacturers in the PCB industry. IST testing requirements have become a standard in some high technology designs. This accelerated stress testing method adopted by IPC (TM-650- method 2.6.26) and has been around for several years. This method allows for the assessment of (PTH) and inner layer to (PTH) barrel connections. A special coupon is required, however coupons designs are available to match your build requirements. The test ends after the hole wall fails. I won't go into detail so look @ www.pwb.com. Hopefully someday this test method will help reduce the amount of microvia x-sectioning required by the industry. Rgds, Brian Carlson Technical Support Engineer Yamamoto Mfg, USA Inc. >>> <[log in to unmask]> 12/09 9:59 AM >>> Hi George Right now we are stuck with microsections and will be until someone has performance data for probably some sort of thermal cycling tests. Eventually, I guess, if a sample passes so many thermal cycles (or thermal shocks, perhaps) then we consider the product and process to be good and we don't care how thick the copper hole walls are or if there are voids or cracks present??????!!!!!!!!! However, the thermal cycling tests take a long time and I would think everyone will still use hole wall thickness and quality of plating to predict that performance. Microvias are not "stand alone" configurations they are usually found on boards that have to see soldering temperatures and therefore are subject to the question - how do they survive thermal stresses. Just my thoughts - but I see microsections to be with us for a little while longer. Susan Mansilla Technical Director Robisan Lab ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################