We have been following the discussion of the warp
"syndrome" for several weeks and have investigated all aspects of the
construction, build, copper distribution, profiling presses, profiling ovens,
and even evaluated a higher Tg material(180C).
We currently have temporarily acquired a horizontal
rack for evaluation to bake the boards and the preliminary results appear very
good. We are using a standard FR4 material (140C). The racks we have
always used in the past were vertical with supports on top and
bottom only. Any response or comments would be welcomed.
Tony Steinke
Circuit Technologies, Inc.
770-458-1700