Hi all,
Got a question for the board manufacturers. What experiences
are you finding regarding solder shorts from Hot air level on the following
designs at the bare board level.
SMT designs with a 14 mil width and a 5 mil space.. no
dams.
We are looking close at this design with significant concern
that in production quantities of 10K +, running this design will result in major
rework for solder bridging after hot air level. We have a vertical
leveler. Do any of you board folks feel this is producible without solder
bridges?
Ed Cosper
ABC