Hey All,

All good points Matt, but what really is at the root of it all is process
capability and the stacking of tolerances. Good point about the V-score, but
in addition to that 1 mil (for instance) you would also best check your
drawing for what manufacturing tolerance you are allowing for score
location. If the toleance given is ±0.005" then the spacing from the edge
just allowing for score alone would be 0.006" (0.001" slope plus the
manufacturing tolerance). Take a look at all the processes that could bring
the ground plane in contact with the edge of the board, start stacking
tolerances. That will give your best answer. ) 0.039" should be very doable.

Bob Dube
ES&D

-----Original Message-----
From: Matthew Lamkin <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, December 10, 1999 11:59 AM
Subject: Re: [TN] Edge Clearance for power & ground planes


>Hi there Ken,
>
>Rather than just give a measurement I'll explain why I keep power &
>ground planes away from the edge of the board.
>
>If the board goes into a panel that is scored, you will need to bear in
>mind that the edge of the board will have
>a slope on it, caused by the V-scoring machine. This is typically 0.5mm
>between boards in a panel.
>Therefor you will lose 0.25mm (0.01") of the laminate around the edges.
>
>If the board is routed, you will not lose this, but it is always good
>practice to keep the same distance away no matter what
>method of panelisation.
>
>Once that is done, then you have to think about the solder resist edges.
>If you have copper and solder resist
>edges at the same distance from the edge you can get nasty things
>creeping under it and corroding the board.
>You need to leave a gap for an area of solder resist before the start of
>your copper areas.
>
>I dare say that this also applies to the bonding of multiple layers, in
>order to provide good adhesion of laminates
>between the layers.
>
>What this then boils down to is keeping copper about 1mm (0.039") away
>from the edge of the board.
>If the board is large & has plenty of room then obviously this can be
>increased, but should never be decreased.
>
>I dare say that its mentioned in one of the IPC specs somewhere. (I'd
>like to know which one?).
>
>There... That's my tuppence...
>
>Hope it helps & doesn't confuse.... TIA - Matt.
>
>
>>-----Original Message-----
>>From:  Ken Patel [SMTP:[log in to unmask]]
>>Sent:  Thursday, December 09, 1999 9:13 PM
>>To:    [log in to unmask]
>>Subject:       [TN] Edge Clearance for power & ground planes
>>
>>Guys,
>>How far my power & ground planes should be away from the egge of the
board?
>>
>>re,
>>ken patel
>>______________________________________________________
>>Ken Patel                       Phone:  (408) 490-6804
>>1708 McCarthy Blvd.             Fax:    (408) 490-6859
>>Milpitas, CA 95035              Beeper: (888) 769-1808
>>
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