Jason, Am I missing something? If you are fluxing with a water soluble, aren't you violating your customer's desire to use a no clean. I would assume that your customer is concerned about ionic residue since they a specing a no clean. I would be more concerned with the approach you are using than I would with just soldering with the water soluble. Wouldn't a full solder cycle be less likely to leave ionic contaminates? I guess that is a question for a flux guru. I have only played with OSPs only a little and I don't run nitrogen in any soldering operations. The first thing I didn't like about them was the poor spread of the solder on the first pass. I could put a spot of paste on a pad and it would not wet much past the area it was deposited at. I also thought the wetting angles, though acceptable, were greater than I am used to seeing. I believe nitrogen is necessary in all soldering operations in order to be successful with an OSP. Anyone - please correct me if I am wrong here. Jason Smith wrote: > I am having problems with wave soldering OSP boards. After the boards have seen > a heat cycle (reflow), they are impossible to get hole fill on topside without > first cleaning the boards to remove either oxidation or hardened OSP. I don't > know which one I have because I haven't had them analyzed yet. The flux used to > wave solder the boards is a very weak customer dictated rosin no clean flux. > The OSP is Cu106A. I am not familiar with OSPs. They won't do HASL either. > Any insight? Suggestions? Assistance? > > As it stands now, the process is to flux with high solids water soluble/heat to > clean the board-->wash off flux-->immediately wave solder with rosin containing > no clean. This is not a production process........ > > Jason Smith > Process Materials Engineer > Lexmark Electronics > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################