Hi.
Mi name is Eric Manrique.

I have joined the technet forum a short while a go and i have learned a
lot by simply reading your Q&A.



Two months a go i started to work for a small company situated in
Montreal, Canada.  We are a subcontracting company for circuit board
assemblies.

I'm in charge of process, and i tend to have some hard discusions with
my quality inspectors.  Any time a solder joint is not nicely spread on
the pad, it does not look stetic or the joint is formed around the leg
but does not grasp it, they call it a cold joint.  Witch involves
production stopages.  They allways blaim the reflow oven, therefore I
have to re-profile the temperature on the oven to, in most cases, prove
them that the profile is working fine.

It has hapened that i found a profile not properly optimised, but then
again the joint was obviously cold in most cases. [Sanddy look and dull
grey and stay in a lump befor or behind the leg], but most often the
problem is simply bad wetting due to component / board or solder paste
contamination.

My delema is that i have no visual aid to prouve/show the quality
inspectors what a bad wetting or a cold joint realy looks like [they
will not take mi word for it, and justly so beacause its no official
proof] .  The IPC has many examples, but when it comes down to SMT
component bad wettings or cold joints, samples are lacking. (its
probably our old edition?)

Is there a document with good visual aid concerning the solder joint
standards, and good examples of non compliance?  Would the newest IPC
revision be sufficient?


Thankyou.

Eric Manrique
Process supervisor.

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