Does anyone have a $ value regarding Ni/Pd/Au v.s. electrolytic Ni/Au? Many thanks. joyce At 07:07 AM 12/8/99 -0700, you wrote: >Paul, > I suspect the use of Palladium is to prevent "black pad" since it has >been found to occur during the immersion gold process. With a Palladium >layer on the nickel, hyper corrosion of the nickel should not occur (in >theory). (it still sounds expensive). > > > Thanks > >Ryan Grant >Process Development Engineer >MCMS >(208) 898-1145 >FAX (208) 898-2789 >[log in to unmask] > > > > > > >No problems 1-5 Darrel, just ask him why standard (flash) NiAu would not >be >sufficient . >>From distance i can't see the need for Pd instep expense. >Check net's archives , all there > >pk > >-----Original Message----- >From: Darrel Therriault [mailto:[log in to unmask]] >Sent: Tuesday, 7 December 1999 4:59 >To: [log in to unmask] >Subject: [TN] Ni/Pd/Au > > >TechNet, > >A PWB supplier is recommending a Ni/Pd/Au finish for .062" and .093" >FR-4 >PWB >with mixed PTH/SMT components, as well as press fit connectors. > >Any comments/guidance, pro or con, regarding : > >1. Intermetalics >2. Rework cycles >3. Gold embriddlement >4. Fine pitch or BGA components >5. Pressfit > >All info appreciated. > >Regards.......DT > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with >following >text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >additional >information. >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] >or >847-509-9700 ext.5365 >############################################################## > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with >following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >additional >information. >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] >or >847-509-9700 ext.5365 >############################################################## > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information. >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or >847-509-9700 ext.5365 >############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################