Rick,
I have the following information to offer you regarding your question
about NASA Handbooks (now being converted into NASA Technical Standards
or cancelled in favor of adopting industry standards). This
information comes from Mr. Garry McGuire who is a contractor helping to
manage NASA Goddard Space Flight Center's Training Facility.
I hope this information helps.
Sincerely,
Jay Brusse
Unisys Corporation at NASA Goddard Space Flight Center
[log in to unmask]
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To: Users of NASA Space
Flight Hardware Workmanship Standards
From: GSFC/300.1/HEI/Garry McGuire
Subject: Status
of NASA Workmanship Standards as of November 9, 1999
1. NHB 5300.4(3A-2) was
cancelled effective 12/97. The current workmanship standard for
hand or wave soldered electrical assemblies is NASA Technical Standard
NASA-STD-8739.3; Soldered Electrical Connections.
2. NAS 5300.4(3G-1) was
cancelled effective 2/98. The current workmanship standard for wiring
space flight hardware is NASA Technical Standard NASA-STD-8739.4;
Crimping, Interconnecting Cables, Harnesses, and Wiring.
3. NHB 5300.4(3H) was
cancelled effective 2/98. The current workmanship standard for crimping
electrical contacts onto space flight wiring harnesses is NASA Technical
Standard NASA-STD-8739.4; Crimping, Interconnecting Cables, Harnesses,
and Wiring.
- Note: The crimping portion of 3H was revised and transferred
into the revised cabling standard (#2 above). The wire wrap portion
will not be renewed by NASA. MIL-STD-1130, Connections, Electrical,
Solderless Wrapped should be used by projects intending to use wire
wrap for flight hardware or mission critical ground support equipment.
4. NHB 5300.4(3I)
was cancelled in May of 1996. Use the Class 3 requirements of
IPC-6011, Generic Performance Specification for Printed Boards; and
IPC-6012, Qualification and Performance Specification for Rigid Printed
Boards. GSFC Code 303 maintains a supplement to these standards
that should be considered by all projects. Contact the GSFC Code
300 library at (301) 286-7240 and request document S312-P-003, the
current revision is “B.”
5. NAS 5300.4(3J-1) is
the current conformal coating and staking standard.
6. NHB 5300.4(3K) was
cancelled in May of 1996. Use IPC-2221, Generic Standard on Printed
Board Design; and IPC-2222, Sectional Design Standard for Rigid Organic
Printed Boards.
7. NHB 5300.4(3L) was
cancelled effective 12/97. The current NASA Technical Standard for
controlling electrostatic discharges is NASA-STD-8739.7; Electrostatic
Discharge Control (Excluding Electrically Initiated Explosive Devices).
- Note: Changes between the two versions of this document apply
only to its structure and numbering format. There are no technical
changes between NHB 5300.4(3L) and NASA-STD-8739.7.
8. NAS 5300.4(3M),
no rev., is the current surface mount technology soldering processes
standard.
9. NASA-STD-8739.5 is
the current fiber optics termination standard.
As each new NASA Technical Standard (NASA-STD-8739.*) is released,
concurrent with publication will be its availability electronically at
the webpage for NASA’s Office of Safety and Mission Assurance at:
Following this link will take you to a drawing tree containing many NASA
documents. The workmanship standards are in the bottom right
corner. Click on the box for any document to see its revision
status or download it in PDF format.
NOTE: NAS 5300.4(3J-1) and NAS 5300.4(3M) are being restructured
into the NASA-STD-8739 series format and will be released as
NASA-STD-8739.1 and NASA-STD-8739.2 respectively. Estimated
completion is sometime around January, 2000.
If you have any questions, I may be reached at (301) 731-8624.
-----Original Message-----
Date: Tue, 28 Dec 1999 15:59:49 -0700
From: "Howieson, Rick" <[log in to unmask]>
Subject: NASA
Hello All,
Heeelp!!! Can't get hold of our NASA rep. Must be one of those government
shut downs. God help their private sector supplier who wants to have time
off? Anyhow, does anyone out there know if NHB 5300.4 (3I) is still in
existence and if so what revision? I've searched throughout NASA's web
site and was unable to locate this spec.
Thanks in advance,
Rick Howieson