Hi Doug, We've been discussing this same issue here at Lockheed. According to IPC-6012 (Qualification and Performance Specification for Rigid Printed Boards) - Section 3.11 (p17), "Special Requirements", reads in part: "When specified on the procurement documentation, some or all of the special requirements listed in the following paragraphs shall apply. ...". Section 3.11.3, which follows this statement, covers fungus resistance. Notice the key words "When specified..". This qualifying comment occurs again in Appendix A (p27). In addition, MIL-HDBK-454, Section 4.4, "Fungus Testing", reads in part: "Group II materials should be subjected to the fungus test specified in MIL-STD-810...". Under Group II materials are epoxy glass-fiber laminates and epoxy resin. Also listed is polyurethane, the main component in Type UR conformal coating. Type AR (acrylic) is listed as a Group I (fungus inert) material. So it sounds like these organic materials are fungus nutrients and, depending on your application environment, may need to treated with fungicide. Since this is a special requirement, it will need to specified on the procurement documentation. Michael Hiteshew Lockheed Martin Launching Systems [log in to unmask] (410) 682-1259 > ---------- > From: Douglas O. Pauls[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;[log in to unmask] > Sent: Friday, December 03, 1999 7:34 AM > To: [log in to unmask] > Subject: Re: [TN] Fungicidal Laminate > > In a message dated 12/02/1999 2:54:44 PM US Eastern Standard Time, > [log in to unmask] writes: > > > > > It seems to be my week for strange requests. > > Does anyone know of a fungicidally treated FR4 laminate? Or of any > > fungicidal treatment which can be applied to an assembled circuit > board. > > > > I can't really see the need for a fungicide. Most IPC specs have the > requirement that the base material, such as laminate, mask, and coating be > non-nutrient in nature, which means it would not support growth of a > fungus. > > Doug Pauls - CSL ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################