Hi all, Hope everyone had a good holiday. Here's a question for you. I have completed an accelerated test to determine the voltage influence on electrochemical migration of copper, under 85C/85%, within a flex circuit. However, I have not been too successful in finding an activation energy from published articles for temperature. Most references go back to the late 70s, early 80s, but deal mainly with silver. However, I don't believe silver to be representative of copper. So, next I thought about the Conductive Filament Formation (CFF, aka Conductive Anodic Filament, CAF) situation in PCB. Maybe close? What do you think? Thanks everyone, Glenn P.S. I even bought ASM Vol 13 like Ingemar suggested, but not specific enough. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################