Hello all,

I too am interested in discussion on this matter. As an assembler using the
boards we currently have our boards shipped to us in individual bags.

The timing on this question is interesting. We are in the process of
performing an experiment to determine the electrical effect of different
conditions on boards that are shipped with and without: bags; peelable mask;
contamination. The planned completion of the experiment is about 2 weeks
away at this point. If there is interest, I will post basic test results
here.

In the meantime, I echo, anyone have any ideas or history?

(Only 23 days to happy day, and 28 days to......well.....who knows what will
happen!?)

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

> -----Original Message-----
> From: Anne Ledger [SMTP:[log in to unmask]]
> Sent: Thursday, December 02, 1999 5:23 AM
> To:   [log in to unmask]
> Subject:      [TN] Bagging Requirements
>
> Good Morning Technet,
>
> I have a question for the board fabrication group.  We are tasked with
> many different requests with regard
> to "bagging" of boards for shipment.  Some customers require individual
> bag and seal, some want anti-static bags, etc.,
> the vast majority of customers do not call out any spec for bagging.  If
> no spec is issued, is it fair to default to
> the IPC-130?  Is 130 still viable?  Looking for some ideas of what the
> rest of you are doing?
>
> Thanks in advance.
>
> Anne Ledger
> EMDS, Inc.
> [log in to unmask]
>

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