Try using nitrogen in the reflow oven. For a short term fix, try screening a little paste on the hole prior to reflow (make sure you can still insert components). You may also have a problem with spray fluxer setup. Are your getting flux all the way up the barrel. Place a paper towel or glass over a bare board and run it over the fluxer. If there is very little flux over some holes, you need to adjust the fluxer setup. My other question is why do you need full hole fill? I have shipped heavy components in high vibration/shock environments on single sided panels with no reliability issues from several employers. Test your products with your worst case hole fill. They will probably pass vibration and shock testing in most class II and III applications for many components. Aric Parr Sr. Process Engineer Eaton Corporation 1400 S. Livernois PO Box 5020 Rochester Hills, MI 48308-5020 248 608 7780 [log in to unmask] ---------- Original Text ---------- From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 12/16/99 7:53 AM: I am having problems with wave soldering OSP boards. After the boards have seen a heat cycle (reflow), they are impossible to get hole fill on topside without first cleaning the boards to remove either oxidation or hardened OSP. I don't know which one I have because I haven't had them analyzed yet. The flux used to wave solder the boards is a very weak customer dictated rosin no clean flux. The OSP is Cu106A. I am not familiar with OSPs. They won't do HASL either. Any insight? Suggestions? Assistance? As it stands now, the process is to flux with high solids water soluble/heat to clean the board-->wash off flux-->immediately wave solder with rosin containing no clean. This is not a production process........ Jason Smith Process Materials Engineer Lexmark Electronics ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################