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Subject: IPC News Release: Assembly Industry Asks Suppliers to Choose
        Alloy
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Contact:        Dan Green
        847-790-5371

FOR IMMEDIATE RELEASE

ASSEMBLY INDUSTRY TO SUPPLIERS: WHICH ALLOY?

Northbrook, IL 12/03/99
=09
The US electronics assembly industry has taken its first major step toward =
the integration of lead-free electronics by establishing a target date of =
April 2000 for alloy suppliers to provide a short list of lead-free =
alternatives.  This date was set at IPCWorks=AE '99 in October, where the =
industry met to discuss the feasibility of solely using lead-free =
materials for printed wiring board assemblies.

"There are currently a number of lead-free options for OEMs.  Narrowing =
this list will make it=20
easier for OEMs to select alloys that meet their product requirements," =
says IPC project manager Chris Jorgensen.

Select industry groups have already proposed specific lead-free alloys for =
industry-wide adoption. The UK-based Printed Circuit Interconnection =
Federation and the International Tin Research Institute are promoting the =
SnAgCu (tin-silver-copper) family, while a breakout session at IPCWorks =
proposed SnAgBi (tin-silver-bismuth). However, there are concerns over the =
compatibility of bismuth with lead printed wiring board finishes, and over =
a potential future ban on silver.

"After an alloy(s) is agreed upon, OEMs will approach component and PWB =
suppliers to develop finishes that work with the alloys," Jorgensen says.

The April target date was established to coincide with IPC's two major =
conferences: IPC Printed Circuits ExpoSM, and the IPC SMEMA Council =
Electronics Assembly Process Exhibition and Conference, APEXSM. =20

IPC is developing an industry roadmap to assist the industry in this area. =
 The latest draft is now available at the IPC lead-free Web site (www.leadf=
ree.org).=20

Roadmap meetings will be held at IPC's Winter Interim Meetings January 26, =
2000, in Tempe, AZ, and at IPC's Electronics Assembly Process Exhibition =
and Conference (APEXSM) in Long Beach, CA, March 16, 2000.  Jorgensen says =
OEM representation at these meetings is essential to the industry's =
successful transition to lead-free electronics.

For information on the roadmap and IPC's continuing activities in this =
area, contact Jorgensen at (847) 790-5328, <a href="/scripts/wa.exe?LOGON=A3%3Dind9912%26B%3D--%26E%3D0%26L%3DLEADFREE%26P%3D66374%26T%3Dtext%252Fplain" target="_parent" >[log in to unmask]</a>, or visit IPC's =
lead-free Web site.=20

IPC is a US-based trade association dedicated to the competitive excellence=
 and financial success of its nearly 2,600 member companies which =
represent all facets of the electronic interconnection industry, including =
design, printed wiring board manufacturing and electronics assembly.  As a =
member-driven organization and leading source for industry standards, =
training, market research and public policy advocacy, IPC supports =
programs to meet the needs of a $33 billion US industry employing more =
than 330,000 people.

//30//

NR9169.leadmap2

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IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.leadfree.org ) for additional information.
For technical support contact Gayatri Sardeshpande <a href="/scripts/wa.exe?LOGON=A3%3Dind9912%26B%3D--%26E%3D0%26L%3DLEADFREE%26P%3D66374%26T%3Dtext%252Fplain" target="_parent" >[log in to unmask]</a> or 847-790-5365.
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