Hi, I am Kenghwa Teo of Institute of Microelectronics (IME), Singapore. I am a new subscriber to the forum. I just understood that in the recent SEMICON-Japan, there was lively discussion on the patent of IOWA State University on Sn/Ag/Cu alloy. May I have the insight from anyone of you on the following: 1. What is the exact alloy composition that the patent covers? 2. How much IP rights does the patent claim? Does it extend to majority of Sn/Ag/Cu alloy? 3. Understand that IOWA has licensed its patent to 3 companies i.e. one each in USA, UK and Japan. Is it true and who are they? Looking forward to hearing from you. Thanks & regards, Kenghwa Teo DID: 65-7705 417 Fax: 65-7745 747 mailto:[log in to unmask] http:\\www.ime.org.sg ################################################################ Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE Leadfree <your full name> To unsubscribe: SIGNOFF Leadfree ################################################################ IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic Assemblies. Please visit IPC's Center for Lead-Free Electronics Assembly (http://www.leadfree.org ) for additional information. For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365. ################################################################