Hi,

I am Kenghwa Teo of Institute of Microelectronics (IME), Singapore. I am a
new subscriber to the forum.

I just understood that in the recent SEMICON-Japan, there was lively
discussion on the patent of IOWA State University on Sn/Ag/Cu alloy. May I
have the insight from anyone of you on the following:
1. What is the exact alloy composition that the patent covers?
2. How much IP rights does the patent claim? Does it extend to majority of
Sn/Ag/Cu alloy?
3. Understand that IOWA has licensed its patent to 3 companies i.e. one each
in USA, UK and Japan. Is it true and who are they?

Looking forward to hearing from you.

Thanks & regards,
Kenghwa Teo
DID: 65-7705 417
Fax: 65-7745 747
mailto:[log in to unmask]
http:\\www.ime.org.sg

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