Hi all,
I think I've fallen behind on the lead issue. So perhaps some
of you can update me a little. I am aware of the environmental ( mostly from
Europe ) push to "get the lead out". I've been watching this with quite
some interest as to what board shops are doing and looking into to eliminate the
HASL process. However, a recent question was posed to me that I simply couldn't
answer. What is proposed to eliminate the tin/lead at the assembly
soldering process? You have to mount ( solder ) all these SMTs and BGAs to
the boards with something. I suspect the volume of tin/lead in the aggregate
solder joints is significantly higher that what was on the delivered bare
board.
Just curious,
Ed Cosper
ABC