Ryan, Tin whiskering has been a problem with immersion tin. There however have been advancements in eliminating this problem. Atotech has added a step to the process which prevents the growth of whiskers. Sincerely, Don Janus Eastern Area Manager Electronic Chemistry Atotech USA Inc. Frank Freitas wrote: > Hello Ryan, > There are numerous suppliers of this process currently, each with their > strengths and weaknesses. I believe the greatest concern with immersion tin > as final finish however is with tin whiskering. > McGean-Rohco, Inc. (Cleveland, Ohio) has just recently presented a technical > paper at the IPC Works which covers this and has developed a solution to the > whiskering issue while at the same time allowing for immersion tin as the > final finish. If you would like additional information please contact George > Bokisa ( Technical Manager-Electronic Chemicals) @ 216-441-4900 in Cleveland > and he will gladly provide you any assistance you may need. > > Regards, > Frank Freitas > Technical Sales Engineer > McGean-Rohco, Inc. > 2910 Harvard Avenue > Cleveland, OH > 216-441-4900 > ------Original Message------ > From: Ryan Grant <[log in to unmask]> > To: [log in to unmask] > Sent: November 3, 1999 7:42:27 AM GMT > Subject: [TN] immersion tin as a surface finish > > Hi Technetters, > Anybody using immersion tin as a surface finish? What are some of its > quirks? We have a customer that wants us to use it, so we are going to > qualify it as soon as we can get some boards in from multiple suppliers. > During the qual, I would like to know ahead of time what problems to > look for. We are currently assuming it will be a drop in for our OSP > and immersion gold boards. (We got rid of HASL a while ago because of > shorting on fine pitch is orders of magnitude high than gold). > > Thanks > > Ryan Grant > Process Development Engineer > MCMS > (208) 898-1145 > FAX (208) 898-2789 > [log in to unmask] > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following > text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## > > ----------------------------------------------- > FREE! The World's Best Email Address @email.com > Reserve your name now at http://www.email.com > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ##############################################################