Dear Tech Net, Is there a standard for manufacturing power supply boards? Such as weight of copper foil for base laminate, amount of copper to be plated on the surface and in the plated through holes? Our application is just double-sided PCB's. Years ago a customer had problems with a power supply board which cooked a trace. To correct the problem they asked our company to plate their panels with a minimum of 2 mil in the holes and on the surface. The design is fairly tough with isolated holes and to get a minimum of 2 we have to plate the isolated areas up to 3. This causes a myriad of problems with other processes. Dry film is trapped and practically impossible to remove completely, thus we have shards- causing shorts ultimately. We have problems printing the LPI and leaving LPI in the holes. It seems starting with a base material of 2 oz copper and plating the holes up to 1 minimum, giving 3+ on the trace would be ample. Starting with 2 oz and plating up to 2 mil, giving 4+ on the trace makes the boards virtually impossible to process effectively. Is it important to have the 2 mil in the hole on a power supply board? Or is a problem more likely due to trace thicknesses? Thanks for your time. Julie Dixon ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################