In a message dated 11/12/1999 3:54:06 AM Central Standard Time, [log in to unmask] writes: << A properly filled 40 mil hole contains more paste than a 70 mil stencil aperture, so please don't forget to pay attention on how to get the paste INTO the holes Experiment with things like squegee speed, pressure, and solderpaste rheology. Daan Terstegge >> Thanks Daan! I'll be running my squeegee speeds real slow to allow as much paste to roll into the holes as possible, and I'm using metal blades...appreciate the input! -Steve Gregory- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################