K.K.- Didn't see any replies, so I'll quote a number that was handy- 16 x 10^-4 cal/cm-sec deg C taken fom page 81, Table 8.1, "Typical Characteristics of Molding Compound Properties", from the Text "Plastic Encapsulated Microelectronics", Ed. by M. Pecht, L. Nguyen, and E. Hakim, TK7874.P428 1995, ISBN 0-471-30625-8, John Wiley & Sons. Michael Alderete ------------------------------ Date: Fri, 29 Oct 1999 15:39:23 -0700 From: KK Chin <[log in to unmask]> Subject: IC package plastic molding compound Can anyone tell me what's the bulk thermal conductivity of the plastic molding compound in an IC package, in the unit of W/M-K? Thanks! K.K. Chin Artesyn Technologies Fremont, CA. ------------------------------ ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################