Scott, Not claiming to have intimate knowledge of LCD interfaces, but wouldn't it be good to put a layer of nickel between the copper foil and gold plating to act as a cheap diffusion barrier, much like is commonly used for wire bonding (COB) applications? Was thinking of 2.5-7.6 um of low stress nickel Steven Creswick - CTS Microelectronics ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################