Here is a repost from an earlier question. I did not get any replies to it, But
I'll try my luck again
Again, thanks for responses
Hello fellow technetters:
Is there a library that addresses pad profile recommendations for wave
soldered BSMT components? What factors influence solder defects (Solder balls,
Bridging,Insufficient solder, etc. on trying to wave solder these BSMT's? Will
be
running a DOE and I would like to see what factors I would need to consider
(Solder speed at exit from wave solder, how close the board is to the wave,
temperature profile, etc.)
Any and all answers are greatly appreciated
Ivan Barrios

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