MIL-S-13949 was cancelled without replacement. The IPC document is not listed as a superceding document and has no QPL but it is a comparable document. Here is a portion of a previous posting that has some of the differences. From: Doug Sober To: [log in to unmask] Subject: [TN] Cancellation of MIL-S-13949H Date: Friday, September 18, 1998 2:59PM isola USA 100 Tillessen Blvd. Ridgeway, SC 29130 +1-803-337-4000 +1-803-337-8821 fax 20 July 1998 To: Isola USA Customers Subject: Conversion to IPC-4101 from MIL-S-13949H As of 30 November 1998, MIL-S-13949H will be canceled by the Defense Supply Center Columbus (DSCC). This means that all references to MIL-S-13949 must be removed from labels, certificates of compliance, part numbers and other pertinent drawings relative to base materials and printed boards. At that time isola USA will only issue certificates of compliance for IPC-4101 which was published December 1997 by the IPC. Isola USA will not be able to certify any base materials to MIL-S-13949H after the 30th November date. Our understanding of the DSCC policy is the 30 November 1998 timeline is on a "point of sale" basis. Materials manufactured before this date but certified after 30 November will still only carry the IPC-4101 certification. Materials shipped from distribution warehouses after 30th November 1998 will have the MIL-S-13949H reference, the Cage Code and the Qualification Reference Number (QRN) crossed off and IPC-4101 inserted on certificates of compliance and master box labels. From a customer viewpoint, the quality levels of base materials shipped will not be affected by this certification change since the performance requirements of IPC-4101 are equal to or more stringent than MIL-S-13949H. Isola USA still plans to conduct what is the equivalent of Group A, B and C inspection on laminates and prepregs as directed by IPC-4101 and our Quality Management Team (QMT). All new product grades not previously listed on a MIL-S-13949H Qualified Product List (QPL) will be qualified at an independent test laboratory and the data readily available for review. I have attached a summary of some of the differences between the two specifications as well as a template letter for you to use with your customers. If you have any questions concerning IPC-4101, please call me directly at 803-337-4203 or fax me your questions at 803-337-8821. With kind regards, Douglas J. Sober Corporate Director of Quality SIGNIFICANT DIFFERENCES BETWEEN MIL-S-13949H AND IPC-4101 General Information Differences Prepregs and laminates are on the same slash sheet. Slash sheets are organized by "families" with open spaces for new materials that fit the family concept. The entire specification is in metric with no English references. The latest test methods are attached to the document. Paragraph 1.2.2 Laminates can be ordered as a dielectric space (without copper) or as an overall thickness (including copper) foil. Currently laminates can only be ordered as a dielectric space. Table 1 The copper foil table now includes type "R", reverse treated electrodeposited for grade 1 and type "S" for reverse treated electrodeposited for grade 3. Paragraph 1.2.5 and 3.8.3.1.2 Surface Quality Class now includes a "D" designation which provides the most stringent surface quality call-out. No pits, dents or epoxy spots over 5 mils. MIL-S-13949H has "B" as the tightest class which allows 1 pit up to 15 mils. Paragraph 1.2.7 Prepregs are ordered using 3 parameters, resin content, resin flow, and the "optional" parameter. Prepreg can be tested by new test methods such as rheology, % Cure, or delta. Paragraph 3.1.2 Quality Conformance Testing is conducted as determined by the Manufacturers Quality System as outlined in IPC-PC-90. In the absence of a Manufacturing Quality System, conformance testing is conducted at the same frequency as MIL-S-13949H. Paragraph 3.1.5, and 3.3 Self declaration form IPC-LQP-1730 is a prerequisite to certifying to IPC-4101. The document IPC-LQP-1730 will be published by the IPC at the same time as the IPC-4101 specification. Paragraph 3.1.7 and 3.4 Qualification testing must be conducted by the supplier at any IPC-QL-653 approved laboratory. The qualification data must be summarized and readily available for review. The qualification testing regime is the same as prescribed by MIL-S-13949H. Paragraph 3.4.1 A thin laminates specimen 10 mils or less qualifies all thin laminates (30 mils and less). A thick laminate specimen greater than 30 mils qualifies all thick laminates. Paragraph 3.4.2 For a given slash sheet, the thinnest prepreg qualifies all the thicker prepregs. Table 5 Table 5 now includes Delta Tg and Average X/Y CTE as optional tests. In the absence of a Manufacturers Quality System, the frequency of testing is the same as MIL-S-13949H. The test method for flammability has been changed from the "MIL" method to the standard UL method 94. Table 6 Electrical tests and some environmental tests are performed on prepregs after pressing into a thin laminate. Prepreg testing for flammability is only conducted as a thin laminate specimen. Paragraph 3.9.1.1 Peel Strength is called out as a single value for 35 micron foil. Foil weights greater than 35 micron must meet the required value for 35 micron. Foils less than 35 micron may be plated up to 35 micron and tested as is the current specified procedure in MIL-S-13949H. Paragraph 3.9.1.2 Dimensional stability is now specified as a nominal value with a tolerance range. The supplier must provide the nominal value for dimensional stability for each construction. Currently the MIL-S-13949H specification uses zero as the nominal value. IPC-4101 will reward consistency of dimensional movement. Paragraph 3.9.2.2.6 Gel Time is an optional test. It can be replaced with other characterization tests if desired such as rheological flow, Cure % or Delta H. Paragraph 3.9.2.2.8 Volatile Content is an optional test. Paragraph 3.10.2.3 Dicy Crystals is an optional test. Paragraph 3.15 MSDS forms must be available for materials supplied under this specification. Paragraph 5.2 The supplier is responsible for establishing written guidelines for their authorized distributors. > -----Original Message----- > From: Marsico, James [SMTP:[log in to unmask]] > Sent: Friday, November 12, 1999 11:39 AM > To: [log in to unmask] > Subject: Re: [TN] MIL-P-13949 > > IPC-4101 replaces 13949 > Jim Marsico > > -----Original Message----- > From: Phil Belliveau [SMTP:[log in to unmask]] > Sent: Friday, November 12, 1999 1:17 PM > To: [log in to unmask] > Subject: [TN] MIL-P-13949 > > Hello Technetters > > Can anyone tell me which IPC standard replaced MIL-P-13949 > > Thanks > Phil > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV > 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at > [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. 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