Dear Technetters,

In our QA, we do a 3-feet drop test on BGA packages (stacked in a tray).
Now I am asked to determine the force on solder balls. I have not done
this before and have not seen any papers on this. Are there any know
equations to do it? Can you refer any papers on this topic? Is it
necessary to use finite element method? I searched the archieve and did
not find anything.

Sincerely,

Yuan Li

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